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Infinix Hot 60

Infinix Hot 60 Comparison & Specs

Infinix Hot 60

  • Dimensity 7020

    6 nm

  • 5200 mAh

    18W

  • 6.7"

    720 x 1600 pixels

  • 50 MP

    1440p@30fps

  • Specs

Redmi 13

Redmi 13 Comparison & Specs

Redmi 13

  • Snapdragon 4 Gen 2 AE

    4 nm

  • 5030 mAh

    33W

  • 6.79"

    1080x2460 pixels

  • 108 MP

    1080p@30fps

  • Specs Redmi 13 Amazon Link
General
Launch Date
July 11, 2025
July 09, 2024
Availability
Available Now
Available Now
Operating System (OS)
Android 15
Android 14
Custom UI
XOS 15.1
HyperOS
OS Updates
2 Years
Security Updates
2 Years (until 2027)
3 Years (until 2027)
Body
Dimensions
166 x 76.8 x 7.8 mm
168.6 x 76.3 x 8.2 mm
Thickness
7.8 mm
8.2 mm
Weight
193 g
205 g
Build Details
Plastic Back, Plastic Frame
Mineral Glass
IP Rating
IP64 (dust tight and water resistant (water splashes))
IP53
Display
Size
6.7 inches
6.79 inches
Type
IPS LCD
IPS LCD
Refresh Rate
120 Hz
120 Hz
Peak Brightness
700 nits
550 nits
Resolution
720 x 1600 pixels
1080x2460 pixels
Pixel Density
262 ppi
396 ppi
Aspect Ratio
20:9
Screen to Body Ratio
85.0 %
85.1 %
Protection
Gorilla Glass 3
Performance
Chipset¹
Mediatek Dimensity 7020
Qualcomm Snapdragon 4 Gen 2 AE
Process Size
6 nm
4 nm
CPU
Octa-core
2x2.2 GHz Cortex-A78
6x2.0 GHz Cortex-A55
Octa-core
2x2.2 GHz Cortex-A78
6x2.0 GHz Cortex-A55
GPU
IMG BXM-8-256
Adreno 613
RAM & Storage
6GB 128GB (UFS 2.2)
6GB 128GB (UFS 2.2)
8GB 128GB (UFS 2.2)
8GB 256GB (UFS 2.2)
RAM Type
LPDDR5X
LPDDR4X
Expandable Memory
Yes
Yes
Camera
Main Camera
50 MP
f/1.6, (wide), AF

+1 unspecified camera
108 MP
f/1.8, (wide), 0.64µm, PDAF

2 MP
(depth)
OIS
No
No
Features
Dual-LED flash
LED flash, HDR, Digital Zoom, Auto Flash, Face detection, Touch to focus, Voice Shutter
Video Recording
1440p@30fps
1080p@30/60/120fps
1080p@30fps
Selfie Camera
8 MP
f/2.0, (wide), 1/4.0"
13 MP
f/2.5, (wide)
Selfie Features
LED flash
HDR
Selfie Video Recording
Yes
1080p@30fps
Connectivity
SIM
Dual SIM
SIM1: Nano, SIM2: Nano
Dual SIM, GSM+GSM
SIM1: Nano, SIM2: Nano (Hybrid)
5G Support
Yes

9 5G bands
n1, n3, n5, n8, n28, n40, n41, n77, n78
Yes

7 5G bands
n1, n3, n5, n8, n28, n40, n78
VoLTE
Yes
Yes
Wi-Fi
Wi-Fi 5
Wi-Fi 5
Wi-Fi Details
802.11 a/b/g/n/ac
802.11 a/b/g/n/ac 5GHz
Wi-Fi Features
Mobile Hotspot
Mobile Hotspot
USB
USB Type-C 2.0, OTG
USB Type-C
Bluetooth
5.4
5.3
NFC
No
No
GPS
Yes with A-GPS
Yes with A-GPS, Glonass
Infrared
No
Yes
UWB (Ultra Wideband)
No
No
Battery
Capacity
5200 mAh
5030 mAh
Removable
No
No
Wired charging
18W
33W
Charging Speed
50% in 30 min
Reverse Wired Charging
No
No
Wireless Charging
No
No
Reverse Wireless Charging
-1W
No
Charger in the Box
Yes
Yes
Sound
Stereo Speakers
No
No
3.5mm Headphone Jack
Yes
Yes
FM Radio
No
Yes
Extra Features
Sensors
Side-mounted fingerprint sensor, accelerometer, proximity, compass
Fingerprint (side-mounted), accelerometer, compass
Others
Virtual proximity sensing
Colors and Pricing
Colors
Sleek Black, Tundra Green, Shadow Blue, Caramel Glow
Black Diamond, Hawaiian Blue, Orchid Pink
Price in India
₹10499
₹11498
FAQs

In this performance comparison, the Infinix Hot 60 with its Mediatek Dimensity 7020 (6nm) performs better than the Redmi 13 with the Qualcomm Snapdragon 4 Gen 2 AE (4nm), thanks to superior chipset efficiency.

Redmi 13 launched with Android 14 and will receive updates, while Infinix Hot 60 has no confirmed OS update information. Both phones are expected to receive security updates until around 2027.

Both Infinix Hot 60 and Redmi 13 use LCD screens. Both smartphones offer the same 120 Hz refresh rate. Infinix Hot 60 also boasts a brighter screen with 700 nits of peak brightness, enhancing outdoor visibility. Notably, Redmi 13 offers a higher screen resolution, resulting in sharper visuals and more detailed content.

Infinix Hot 60 comes with a larger 5200 mAh battery, which may offer longer usage on a single charge. Redmi 13 also supports faster wired charging at 33W, compared to 18W on Infinix Hot 60.

Infinix Hot 60 offers better protection against water and dust with an IP64 rating.

¹ Scores can vary even with the same chipset due to RAM, thermals, and software optimization.