Realme 13

Realme 13 Comparison & Specs

Realme 13

  • Dimensity 6300

    6 nm

  • 5000 mAh

    45W

  • 6.72"

    1080x2400 pixels

  • 50 MP

    1440p@30fps

  • Specs Realme 13 Amazon Link
General
Launch Date
August 29, 2024
Availability
Available Now
OS
Android 14
Custom UI
Realme UI 5.0
OS Updates
2 Years
Security Updates
3 Years
Body
Dimensions
165.6 x 76.1 x 7.8 mm
Thickness
7.8 mm
Weight
190 g
IP Rating
IP64
Display
Size
6.72 inches
Type
IPS LCD
Refresh Rate
120 Hz
Peak Brightness
580 nits
Resolution
1080x2400 pixels
Pixel Density
392 ppi
Aspect Ratio
20:9
Screen to Body Ratio
86.5 %
Performance
Chipset¹
Mediatek Dimensity 6300
Process Size
6 nm
CPU
Octa-core
2x2.4 GHz Cortex-A76
6x2.0 GHz Cortex-A55
GPU
Mali-G57 MC2
RAM & Storage
8GB 128GB (UFS 2.2)
8GB 256GB (UFS 2.2)
RAM Type
LPDDR4X
Expandable Memory
Yes
Camera
Main Camera
50 MP
f/1.8, 26mm (wide), PDAF, OIS

2MP
f/2.4, depth
OIS
Yes
Features
LED flash, HDR, panorama, 10 x Digital Zoom, Auto Flash, Face detection, Touch to focus
Video Recording
1440p@30fps
1080p@30/60fps
Video Recording Features
Dual Video Recording, gyro-EIS, OIS
Selfie Camera
16 MP
f/2.5, 24mm (wide), 1/3.0"
Selfie Video Recording
1080p@30fps
Connectivity
SIM
Dual SIM, GSM+GSM
SIM1: Nano, SIM2: Nano (Hybrid)
SIM 1
9 5G Bands

FDD: N1, N3, N5, N8, N28
TDD: N40, N41, N77, N78
SIM 2
9 5G Bands

FDD: N1, N3, N5, N8, N28
TDD: N40, N41, N77, N78
VoLTE
Yes
Wi-Fi
Wi-Fi 5
Wi-Fi Details
802.11 a/b/g/n/ac 5GHz
Wi-Fi Features
Mobile Hotspot
USB
USB Type-C 2.0
Bluetooth
5.3
NFC
No
GPS
Yes with A-GPS, Glonass
Infrared
Yes
UWB (Ultra Wideband)
No
Battery
Capacity
5000 mAh
Type
Li-Polymer
Removable
No
Wired charging
45W
Charging Speed
50% in 30 min
Wireless Charging
No
Reverse Wireless Charging
No
Charger in the Box
Yes
Sound
Stereo Speakers
Yes
3.5mm Headphone Jack
Yes
FM Radio
No
Extra Features
Sensors
Fingerprint (side-mounted), accelerometer, gyro, proximity, compass
Colors and Pricing
Colors
Speed Green, Dark Purple
Price in India
₹13399

¹ Scores can vary even with the same chipset due to RAM, thermals, and software optimization.