Samsung Galaxy F16 alternatives

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Samsung Galaxy F16

Samsung Galaxy F16 Comparison & Specs

Samsung Galaxy F16

  • Dimensity 6300

    6 nm

  • 5000 mAh

    25W

  • 6.7"

    1080 x 2340 pixels

  • 50 MP

    1080p@30fps

  • Specs
General
Launch Date
March 11, 2025
Availability
Available Now
OS
Android 15
Custom UI
One UI 7
OS Updates
6 Years
Security Updates
6 Years
Body
Dimensions
164.4 x 77.9 x 7.9 mm
Thickness
7.9 mm
Weight
191 g
Build Details
Plastic Back, Plastic Frame
IP Rating
IP54 (dust protected and water resistant (water splashes))
Display
Size
6.7 inches
Type
Super AMOLED
Refresh Rate
90 Hz
Peak Brightness
800 nits
Resolution
1080 x 2340 pixels
Pixel Density
385 ppi
Aspect Ratio
19.5:9
Screen to Body Ratio
86.0 %
Performance
Chipset¹
Mediatek Dimensity 6300
Process Size
6 nm
CPU
Octa-core
2x2.4 GHz Cortex-A76
6x2.0 GHz Cortex-A55
GPU
Mali-G57 MC2
RAM & Storage
4GB 128GB
6GB 128GB
8GB 128GB
Expandable Memory
Yes
Camera
Main Camera
50 MP
f/1.8, (wide), 1/2.76", 0.64µm, AF

5 MP
f/2.2, (ultrawide), 1/5.0", 1.12µm

2 MP
f/2.4, (macro)
OIS
No
Features
LED flash, panorama, HDR
Video Recording
1080p@30fps
Selfie Camera
13 MP
f/2.0, (wide), 1/3.1", 1.12µm
Selfie Video Recording
1080p@30fps
Connectivity
SIM
Dual SIM
SIM1: Nano, SIM2: Nano (Hybrid)
SIM 1
11 5G Bands

FDD: N1, N3, N5, N7, N8, N28, N66
TDD: N40, N41, N77, N78
SIM 2
11 5G Bands

FDD: N1, N3, N5, N7, N8, N28, N66
TDD: N40, N41, N77, N78
VoLTE
Yes
Wi-Fi
Wi-Fi 5
Wi-Fi Details
802.11 a/b/g/n/ac 5GHz
Wi-Fi Features
Mobile Hotspot
USB
USB Type-C 2.0
Bluetooth
5.3
NFC
Yes
GPS
Yes with A-GPS, Glonass
Infrared
No
UWB (Ultra Wideband)
No
Battery
Capacity
5000 mAh
Removable
No
Wired charging
25W
Wireless Charging
No
Reverse Wireless Charging
No
Charger in the Box
No
Sound
Stereo Speakers
No
3.5mm Headphone Jack
No
FM Radio
No
Extra Features
Sensors
Side-mounted fingerprint sensor, accelerometer, gyroscope, proximity, compass
Colors and Pricing
Colors
Bling Black, Glam Green, Vibing Blue
Price in India
₹11499

¹ Scores can vary even with the same chipset due to RAM, thermals, and software optimization.